Seite 10 von PACE Sodr-Tek von Wetec GmbH & Co. KG

conductive systems power sources tek-link tek-link is a unique integration feature that gives maximum flexibility to conductive st systems tek-link allows the hi-flo pump in the st 125/st 145 to be activated by the handpiece switch while plugged into the st 25/st 45 system for example when a tek-link cable 1332-0252-p1 is installed between an st25/45 and an st125/145 handpieces that require airflow or vacuum from the hi-flo pump can be powered by the st 25/st 45 while the air connection is plugged into the hi-flo pump on the st 125 st 145 up to three single channel systems can be connected to one st 125/st 145 using tek-link with the optional tek-link multiplex box 6000-0286-p1 convective systems convective systems use hot air to reflow solder joints and are often thought of as a safer method for removing and installing components from pcbs because of the non-contact process these systems use a pump to generate airflow that first passes through a heater where it is warmed to the appropriate temperature and then through a nozzle that shapes the air stream for the specific component more than 75 different nozzles are available for sodr-tek systems convective systems are ideal for removing surface mount components as they leave little residual solder on the pcb when compared to conductive techniques they are also appropriate for installing leaded components with solder paste and for installing components without visible leads such as bgas mlfs lgas and lccs the ideal system and accessory items depend on the application component sensitivity component type and other factors for high mass applications and for components without visible leads it is strongly recommended that a preheater and pcb holder be used in conjunction with the convective system to ensure thorough heating and to eliminate pcb damage and warping sodr-tek is pleased to offer three systems to meet your exacting specifications please refer to the table below to assist with system selection convective system selection chart applications optional teklink multiplex box st 300 st 325 st 350 standard pitch component removal fine pitch component removal standard pitch area array component removal fine pitch area array component removal standard pitch component installation fine pitch component installation standard pitch area array component installation fine pitch area array component installation snap-vac technology snap-vac technology is a patented feature that assures the fastest rise time when desoldering which ensures that 1 all of the molten solder is pulled from the joint and 2 that it is pulled back into the collection chamber before it solidifies to prevent tip clogging snap-vac technology vacuum rise time max inches of hg same static head of vacuum competitor s slow -rise vacuum without snap-vac technology pace s quick-rise vacuum with snap-vac technology 4 20 100 200 300 400 milliseconds maximizing tip life pace recommends the following practices to maximize tip life 1 always use the lowest possible temperatures while soldering high temperatures cause tips to oxidize faster which reduces heat transfer and damages the protective iron plating 2 avoid aggressive fluxes whenever possible aggressive fluxes erode tips faster shortening their useful life 3 always use a properly sized tip for the work tips that are too small will wear out faster and tips that are too large will wear unevenly which in turn will change the tip geometry rendering it useless 4 always tin tips when not in use and after cleaning on a damp sponge a coating of solder will prevent oxidation from forming which causes tips to lose their tinning or wetting capability 5 always feed solder wire into the heated work not the tip feeding solder directly into the tip will cause pin-holes in the tip and will cause the flux in the solder wire to be burned off before it can activate and prepare the surfaces being soldered should tips lose their tinning or wetting capability a tip cleaner such as sodr-tek s tip-brite may be used to restore them st 300 reflowing a plcc st 350 reflowing a bga component 18 www.paceworldwide.com www.paceworldwide.com 19

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